The 3D stacked die packaging market has been growing due to the increasing demand for higher performance and more compact electronic devices, such as smartphones, tablets, wearables, and IoT devices. The ability to integrate multiple functions and technologies within a smaller footprint has driven the adoption of this packaging technology.

Market trends in 3D stacked die packaging include the development of new materials, advanced TSV fabrication techniques, and the integration of heterogeneous components (combining different types of chips in a single stack). Additionally, as the technology matures, the cost of production is expected to decrease, making it more accessible for various applications.